Tsinghua University associate professor Gan Lin has become the first Chinese scholar to receive the Jack Dongarra Early Career Award, one of the most prestigious honors for young researchers in high-performance computing (HPC). The award was presented on Jun 9 at the opening ceremony of the 40th International Supercomputing Conference (ISC 2025) in Hamburg, Germany.
Established in 2023 by the ISC and named after Turing Award winner and HPC pioneer Jack Dongarra, the annual award recognizes outstanding early-career researchers—within 10 years of earning their PhD—who have made significant contributions in computational science, numerical algorithms, parallel software, machine learning, and related HPC fields. Winners are invited to deliver a keynote speech at the conference.
Following the award ceremony, Gan Lin, an associate professor at the Yau Mathematical Sciences Center of Tsinghua University, presented his latest research on improving the parallel efficiency of numerical algorithms in large-scale supercomputers.
Specializing in numerical algorithms and interdisciplinary HPC research, Gan has conducted extensive work in highly scalable parallel methods, performance optimization software, and next-generation HPC systems. He has led or participated in developing a series of high-performance computing solutions for critical scientific problems, enabling efficient deployment and optimization of numerical applications on cutting-edge supercomputers.
In recent years, his team's breakthroughs have been applied to domestic supercomputers, including the Sunway TaihuLight system, enhancing performance and precision in earthquake simulation, climate modeling, biomedicine, and quantum computing.
ISC officials praised the achievement as a testament to China's growing expertise and global influence in supercomputing. With the continuous advancement of China's HPC infrastructure and deepening international collaboration, more Chinese researchers are expected to emerge as leaders in numerical computing, artificial intelligence, and scientific simulation.
Source: Science and Technology Daily, VOC
